Semiconductor Division - Package Test
Underfill
Characteristic：
1
Low warpage liquid packaging adhesive (wafer-level packaging).
2
Thermal management materials (high thermal conductivity/high thermal insulation).
3
High reliability underfill material.
4
High-strength chip bonding material.
5
High weather resistance surface coating material.
Display Division
Flexible material
Conductive polymer
Protective Film
Display Adhesive
Semiconductor Division
Process equipment Division