Semiconductor Division - Package Test
Thermal Interface Material
Extra Soft High Thermal Conductive Adhesive
FLIP CHIP：
Characteristic：
- 1 High thermal conductive.
- 2 Excellent adhesion.
- 3 UV Heat cure silicone material enhances higher productivity than heat cure only.
- 4 Low coefficient of expansion and shrinkage.
- 5 Good dielectric property and heat resistance.
- 6 Extremely low stress and low Young Young’s modulus.
- 7 Excellent resistance to thermal distortion and warpage.
- 8 Excellent filling and dispersion.
Typical product data：
Typical cured properties(120℃ × 1 hour + 150℃ × 2 hours)：
Application：
- 1 Semiconductor package.
- 2 High-performance computing chips.
- 3 5G network equipment.
- 4 Smartphones.
- 5 Vehicle systems.
- 6 Heat sink modules.
Display Division
Flexible material
Conductive polymer
Protective Film
Display Adhesive
Semiconductor Division
Process equipment Division