Semiconductor Division - Wafer Test

Wafer Test - Wafer Probe

Due to the recent rapid development of semiconductor engineering and design technology. Today's electronic products are becoming thinner and thinner, require high-efficiency and low-power development. The integration and operating frequency of semiconductor chips are rapidly updating.

Vertical Probe Card

Vertical Probe Card is an important test interface before the wafer dicing and packaging.
Probe Card tests the quality of wafers and avoids packaging costs of defective products. It is an important technology and interface that has a huge impact on manufacturing costs in integrated circuit manufacturing.
The Device Pad form commonly used in the non-memory field has an irregular two-dimensional arrangement. In order to correspond to the Probe form of these components, there is a Vertical Probe Card.
Cobra Needle is the core component used in the Vertical Probe Card and is implanted in a high-density vertical direction.